AI Patent Summary

Patent Document
#US6509825B1
United States Patent
Abstract
Aradio frequency transponder device in an integrated circuit package requires only one dedicated pin for connection to a parallel resonant tuned circuit for receiving a remote signal. The one dedicated pin has a capacitor which blocks direct current (DC) flow and allows independent DC biasing of a radio frequency amplifier for increased signal amplification gain. Another package pin used for common power or ground connections supplies the second connection to the resonant tuned circuit. Multiple transponder inputs may be implemented in a single integrated circuit package using only one dedicated pin per input plus one common pin which may be used for another purpose, such as a power or a ground connection. 21 Claims, 6 Drawing Sheets DC Bias Level Measurement & Control
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Patent Classification & AI Product Mapping
Authoritative patent classification definitions mapped to real-world technology domains and commercial product categories.
CPC H04B1/00
Confidence: High
Official Definition
Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
ELECTRICITY > ELECTRIC COMMUNICATION TECHNIQUE > TRANSMISSION
AI Technology & Product Mapping
Technology Domain:
Radio Frequency & Wireless Communications
Product Category:
Wireless Communication Integrated Circuits
Plain-English Summary:
General structural details and circuit arrangements used in communication transmission systems that do not fit into more specific transmission categories.
Relation to Claims:
The patent details general structural configurations for a radio frequency transponder device integrated circuit package communicating via a tuned circuit.
CPC H04B1/59
Confidence: High
Official Definition
Responders; Transponders
ELECTRICITY > ELECTRIC COMMUNICATION TECHNIQUE > TRANSMISSION
AI Technology & Product Mapping
Technology Domain:
Radio Frequency Identification (RFID) & Transponders
Product Category:
RFID Tags & Wireless Transponder Chips
Plain-English Summary:
Devices that automatically transmit a predetermined message or signal in response to a received interrogation signal.
Relation to Claims:
The core invention relates directly to a radio frequency transponder device packaged in an integrated circuit that connects to a parallel resonant tuned circuit.
CPC H03F3/00
Confidence: High
Official Definition
Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
ELECTRICITY > ELECTRONIC CIRCUITRY > AMPLIFIERS
AI Technology & Product Mapping
Technology Domain:
Analog & Mixed-Signal Circuitry
Product Category:
Semiconductor Amplifiers
Plain-English Summary:
Electronic circuits designed to increase the power, voltage, or current of a signal using exclusively vacuum tubes or semiconductor components like transistors.
Relation to Claims:
The transponder device utilizes an integrated radio frequency amplifier to amplify the received remote signal using semiconductor components.
CPC H03F3/189
Confidence: High
Official Definition
High-frequency amplifiers, e.g. radio frequency amplifiers
ELECTRICITY > ELECTRONIC CIRCUITRY > AMPLIFIERS
AI Technology & Product Mapping
Technology Domain:
Radio Frequency (RF) Integrated Circuits
Product Category:
RF Amplifiers & Front-End Modules
Plain-English Summary:
Electronic amplifier circuits specifically designed to process high-frequency or radio frequency signals.
Relation to Claims:
The invention involves a radio frequency amplifier within the transponder device that benefits from independent DC biasing for increased signal amplification gain.
CPC H03F3/19
Confidence: High
Official Definition
High-frequency amplifiers, e.g. radio frequency amplifiers with semiconductor devices only
ELECTRICITY > ELECTRONIC CIRCUITRY > AMPLIFIERS
AI Technology & Product Mapping
Technology Domain:
Radio Frequency (RF) Integrated Circuits
Product Category:
RF Amplifier ICs
Plain-English Summary:
High-frequency or radio frequency amplifier circuits built exclusively using solid-state semiconductor devices like transistors.
Relation to Claims:
The integrated circuit package implements the high-frequency transponder amplifier using semiconductor technology with specialized pin and DC biasing configurations.